TEMPE, ARIZONA, March 29, 2001... On March 1, 2001 Park Electrochemical Corp. (NYSE - PKE) held an open house celebrating the completion of the major expansion of the facilities of its Neltec business unit in Tempe, Arizona.

During the ceremony, Brian Shore, President and CEO of Park; Bob Forcier, President of Neltec; and special guest Nasser Grayile, Director of Assembly Technology Development of Intel Corporation, spoke about new technologies, changes in the industry and the features of the new expansion. In attendance were approximately 200 customers, OEMs, suppliers, project contractors and Park/Nelco and Neltec personnel.

		Jay Grover, Bob Forcier and Brian Shore cut the ribbon to begin the days' festivities at the Neltec Expansion Open House.
(click picture for larger image)

The company's Neltec business unit specializes in high performance and low-loss materials for very high technology electronic interconnection applications. The new expansion will primarily manufacture Neltec's high-speed low loss products, including the N4000-13, N6000 and the SI™ series. In addition to increased manufacturing capacity, some of the notable features of the new expansion include increased safety and comfort levels for employees and Class 1000 clean rooms.

Bob Forcier, Neltec Inc.'s President, said, "The increased focus of OEMs on wide-band and high-speed digital computing in the 1 GHz to 40 GHz range is requiring significant expansions in advanced electronic materials manufacturing capability and material technology. This technology-shift is creating exciting new opportunities for our high-speed, low-loss products. Neltec's unique SI materials have been designed specifically for high frequency digital and microwave applications for the communications industry. Our new expansion will enable us to continue to grow and provide more capacity to our customers as the need for our technology at the OEM level expands in the application areas of wireless infrastructure, broadband network server-routers, optical routers, and high-speed computing."

Certain portions of this press release may be deemed to constitute forward looking statements that are subject to various factors which could cause actual results to differ materially from Park's expectations. Such factors include, but are not limited to, general conditions in the electronics industry, Park's competitive position, the status of Park's relationship with its customers, economic conditions in international markets, the cost and availability of utilities, and the various factors set forth under the caption "Factors That May Affect Future Results" after Item 7 of Park's Annual Report on Form 10-K for the fiscal year ended February 27, 2000.

Park Electrochemical Corp. is a leading global designer and producer of electronic materials used to fabricate complex multilayer printed circuit boards and interconnection systems. Park specializes in advanced materials for high layer count circuit boards and high-speed digital broadband telecommunications, internet and networking applications. Park's electronic materials business operates through fully integrated business units in Asia, Europe and North America. The Company's major manufacturing facilities are located in Singapore, England, France, Germany, New York, Arizona and California. Park's electronic materials business operates under the "Nelco" and "Neltec" names.

If you have problems or questions contact webmaster@parkelectro.com