|
LAKE SUCCESS,
New York, July 10, 2002... Park
Electrochemical Corp. (NYSE
- PKE) announced that it had received Notice of Authorization
from UL for the manufacture of mixed packages using N4000-13 core
and FR-4 prepreg and Notice of Authorization for mixed packages
using N6000 core and FR-4 prepreg.
Both mixed package
options will allow designers and engineers to develop enhanced PCB
builds and to improve process capabilities. In some cases, the mixed
package approach can lower the material cost for designs that include
mixed materials.
The N4000-13
digital broadband product is primarily used for sophisticated high-speed,
low-loss, high bandwidth electronic infrastructure applications,
especially in the telecommunications, networking and internet industries.
The N6000 system
is designed for next generation signal integrity (SI) applications
such as low loss backplane technology, wide bandwidth network servers
and workstations, advanced optoelectronic assemblies and cellular
interconnects.
The N4000-13
and the N6000 systems are designed to be robust for high speed digital
applications in the 1 - 10+ GHz range and are available in both
prepregs and laminates, including ultra thin dielectrics. These
materials are also available with SI technology for very high
frequency applications.
Park Electrochemical
Corp. is a leading global designer and producer of electronic materials
used to fabricate complex multilayer printed circuit boards and
interconnection systems. Park specializes in advanced materials
for high layer count circuit boards and high speed digital broadband
telecommunications, internet and networking applications. Park's
electronic materials business operates through fully integrated
business units in Asia, Europe and North America. The Company's
manufacturing facilities are located in Singapore, China, Germany,
France, England, Connecticut, New York, Arizona and California.
Park's electronic materials business operates under the "Nelco"
name.
|