Melville, New York, November 18, 2008…..Park Electrochemical Corp.
(NYSE-PKE) announced a workforce reduction at its Neltec, Inc.
high-technology electronics circuitry materials business unit located in
Tempe, Arizona. As a result of this workforce reduction, the Company
expects to report a charge of less than $100,000 for employment
termination benefits in the third quarter of the Company’s current
fiscal year ending March 1, 2009. The Company does not expect this
workforce reduction to have any impact on Neltec’s service to its
customers.
Brian Shore, Park’s President and CEO, said, “This is a sad event for
Park. I would like the Neltec employees affected by the workforce
reduction to know that I am personally very sorry that things have
worked out this way. Thank you very much for your service to Neltec and
Park. I wish you and your families the very best in the future”.
Certain portions of this press release may be deemed to constitute
forward looking statements that are subject to various factors which
could cause actual results to differ materially from Park’s expectation.
Such factors include, but are not limited to, general conditions in the
electronics and aerospace industries, Park’s competitive position, the
status of Park’s relationships with its customers, economic conditions
in international markets, the cost and availability of raw materials,
transportation and utilities, and the various other factors set forth in
Item 1A “Risk Factors” and under the caption “Factors That May Affect
Future Results” after Item 7 of Park’s Annual Report on Form 10-K for
the fiscal year ended March 2, 2008.
Park Electrochemical Corp. is a global advanced materials company which
develops and manufactures high-technology digital and RF/microwave
printed circuit materials principally for the telecommunications and
internet infrastructure and high-end computing markets and advanced
composite materials, structures and components principally for the
aerospace markets. Park’s core capabilities are in the areas of polymer
chemistry formulation, coating technology and advanced composite
structures and component design and fabrication. The Company’s
manufacturing facilities are located in Singapore, China, France,
Connecticut, New York, Kansas (under construction), Arizona, California
and Washington.
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