Park Electrochemical Corp. Press Release

PARK ELECTROCHEMICAL CORP. ANNOUNCES INTRODUCTION OF ITS NEW N7000-3 POLYIMIDE LAMINATE MATERIAL FOR USE IN SPACE AND OTHER APPLICATIONS

Melville, New York, Thursday, November 10, 2011……Park Electrochemical Corp. (NYSE - PKE) announced the introduction of its new N7000-3 laminate material to complement its existing N7000-3 prepreg. N7000-3 laminate joins Park’s existing family of polyimide laminate and prepreg materials, offering a prepreg and laminate system, with a UL 94V-1 designation, that meets the NASA requirements of no visible bromine. This new advanced material system is available globally.

Park’s new N7000-3 laminate material is a high-Tg polyimide using toughened resin chemistry. This material is designed for use in a wide variety of applications that require fine geometry, multilayer construction or extreme reliability. N7000-3 has been available since 1999 as a prepreg material for use with Park’s N7000-2 HT laminate. With the introduction of N7000-3 laminate material, Park’s electronics customers will now be able to fabricate printed circuit boards with a pure N7000-3 construction.

For information regarding N7000-3 in North and South America, contact Neltec, Inc. at +1-480-967-5600; for information regarding N7000-3 in Europe, the Middle East, and Africa, contact Neltec, SA at +33-562-985290; and for information regarding N7000-3 in Asia and Australia, contact Nelco Products Pte. Ltd. at +65-686-17117.

Certain portions of this press release may be deemed to constitute forward looking statements that are subject to various factors which could cause actual results to differ materially from Park’s expectations. Such factors include, but are not limited to, general conditions in the electronics and aerospace industries, Park’s competitive position, the status of Park’s relationships with its customers, economic conditions in international markets, the cost and availability of raw materials, transportation and utilities, and the various factors set forth in Item 1A “Risk Factors” and under the caption “Factors That May Affect Future Results” after Item 7 of Park’s Annual Report on Form 10-K for the fiscal year ended February 27, 2011.

Park Electrochemical Corp. is a global advanced materials company which develops and manufactures high-technology digital and RF/microwave printed circuit materials principally for the telecommunications and internet infrastructure and high-end computing markets and advanced composite materials, parts and assemblies for the aerospace markets. Park’s core capabilities are in the areas of polymer chemistry formulation and coating technology. The Company’s manufacturing facilities are located in Singapore, China, France, Connecticut, Kansas, Arizona, California and Washington.

Additional corporate information is available on the Company’s web site at www.parkelectro.com.

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