is a global advanced materials company which develops and manufactures high-technology digital and RF/microwave printed circuit materials principally for the telecommunications and internet infrastructure and high-end computing markets and advanced composite materials, structures and components principally for the aerospace markets. Park's core capabilities are in the areas of polymer chemistry formulation, coating technology and advanced composite structures and component design and fabrication. The Company's manufacturing facilities are located in Singapore, China, France, Connecticut, New York, Kansas (under construction), Arizona, California and Washington.
are designed for aircraft primary and secondary structures, interiors and radomes. Broadgoods, unidirectional/ biased tapes, and molding compounds are available.
are designed for critical microwave components, antennas and subassemblies. Tightly controlled electrical and mechanical properties ensure consistent performance.
include a full selection of advanced electronic materials for reliable, high-performance, multilayer designs. All PCB materials are RoHS compliant. Lead-free materials and high speed materials are available.
are high-tech, lightweight composite structures providing unique solutions primarily for general aviation and other aerospace applications.