The History of Park Electrochemical Corp.

1954
Park Electrochemical Corp. was founded.

 
Park's Walden, NY subsidiary, 1971
 

1957
Park believes it founded the modern day printed circuit industry with the invention of an epoxy-glass, copper-clad laminate in Stamford, CT.

 

1962
Park believes it invented the first multilayer printed circuit materials system.

     

Nelco SA was acquired in 1984
  1965
Park Electrochemical Corp. opened it's second subsidiary, Nelco Products, Inc., in Anaheim, CA.
   
  1969
Park lead the way in the globalization of the electronic substrates industry by opening its Nelco UK subsidiary.
   
  1971
Park's Stamford, CT operation moved to a larger location in Walden, NY.
     
1984
Park constructed new manufacturing facilities in Fullerton, CA and Skelmersdale, England to service the company's growing electronic materials customer base and the printed circuit board industry's higher technology needs. Park acquired it's Nelco SA facility in France to further service the European continent. Park pioneered the use of vacuum lamination. The Nelco Technology Inc. semi-finished multilayer facility was constructed in Tempe, AZ.
 
Nelco Products, PTE Grand Opening 1986
 
1986
Park constructed its Nelco Products, PTE facility in Singapore to further participate in the globalization of the electronic substrates industry into the Asia Pacific.
     

World-class advanced materials manufacturing at
Neltec, Inc. in Arizona
  1988
Park acquired FiberCote Industries, originally established in the early 1950s. It was renamed Park Advanced Composite Materials, Inc. in 2008. This business unit manufacturers Nelcote® advanced composite materials.
 
   
  1992
Park opened Neltec, Inc., an advanced materials manufacturing and R&D facility, in Tempe, AZ.  Park acquired Metclad, later renamed to Neltec S.A., in Lannemezan, France to extend the company's Nelco® business into the RF/Microwave and military markets.
     
1993
Park's Nelco Products, PTE facility doubles its manufacturing capacity providing additional support for higher technology manufacturing.
 
Neltec, Inc. North opened in 2001
 
1997
Park acquires Dielektra GmbH to expand its ability to provide Nelco® PCB materials in Europe.
 

1998
Park begins focusing the Nelcote® brand advanced composite materials on the aerospace market.

     

Advanced automation technology at Park's
Nelco Products, Inc. facility in Fullerton, CA
  1999
Nelco Products, Inc. in Fullerton, CA acquires QLP laminates to support United States production demands.
 
2000
Park offers the advanced composite material industry’s first FAA Accepted Design Allowables Database that can be shared by multiple users.
 
2001
Park completes expansions of its Nelco® electronic material manufacturing facilities in Fullerton, CA and Newburgh, NY updating to state-of-the-art automation and the highest quality standards. Neltec, Inc. in Arizona expands equipment and capabilities to offer Nelco® RF/Microwave materials in the United States, including materials for long laminate antenna applications. Park exits the mass lamination market in the United States.
     
2002
Park opens a Nelco® electronics material facility in Wuxi, China to support the growing Chinese marketplace. The European operations are consolidated with the closure of UK manufacturing.
 
Unidirectional tape equipment at Nelcote, Inc. in Waterbury, CT.
   
2003
The Nelco Products, PTE facility undergoes another expansion. North American operations are realigned for efficiency. R&D expands at Neltec, Inc. in Arizona. Park exits the mass lamination market in Europe. Park and Snecma Propulsion Systems entered into a long-term agreement, in which Park will market and distribute SPS’s Raycarb C2 carbonized rayon fabric to manufacturers of rocket motors for tactical and heavy launch vehicle motors.
 
     

Park's expansion in Singapore
  


Park's Nelco Technology Zhuhai facility

2004
Park Electrochemical Corp. reaches it's 50th Anniversary! Park begins constructing a new manufacturing facility in Zhuhai, China. The Nelcote E-765 Family of Prepregs and Databases is qualified and in-use on more than 15 important civil and military aerospace programs since 2000, including the Gulfstream G-200 9-11 passenger business jet. Park realigns itself as a global advanced materials company.
2005
The Nelco Technology Zhuhai facility is completed. Advanced composite materials are now known as Nelcote® brand materials.
     

2007

Park broke ground on a new advanced composite factory in Singapore. Park also announced an upcoming composites facility in Kansas.
 
Pioneer Road Advanced Composites Facility in Singapore
 
 
  Nelco®, Nelcote®, RTFoil®, CoreFix®, PeelCote™, SI®, LD®, EP™ and EF® are trademarks of Park Electrochemical Corporation  
If you have problems or questions
contact webmaster@parkelectro.com

March 31, 2008